Kensington Laboratories is associated as one of the technology leaders in semiconductor wafer handling automation products. You must be glad to know that the Kensington Laboratories' ADO is among the proven in volume manufacturing at major 300mm production fabs. It is backed by Kensington's global service & support network.
What is the exact meaning of FOUP?
The term FOUP is referred to as the 'Front Opening Universal Pod.' It is basically an exclusive plastic enclosure that is equipped for handling silicon wafers in a secure environment. There is also one other name for the FOUP, i.e., 'Front Opening Unified Pod.' The main purpose of the FOUP is to allocate the wafers in the machines in order to enhance the processing performance. During the mid-1990s, 300mm FOUP was created as the wafer processing tool. An ample of companies have designed their FOUPs in many color combos, product sizes, etc.
Furthermore, the IC processing equipment & FOUP may offer the nitrogen ecosystem to increase the device's productivity. Earlier, most of the engineers may only develop the 300mm FOUP along with the detachable cassette in order to keep the wafer in the correct position. But nowadays, the 400 mm wafer FOUP load ports can also be easily accessible from the robotics lab.
Control Humidity using the Front Opening Unified Pod in a Mini-Environment
The wafer placement is done with the help of FOUP (Front Opening Unified Pod); when the production chain is in the waiting mode. This is one of the traditional approaches in order to remove the contamination in which the Front Opening Unified Pod is purified with the gas & thus, maintain the cleanliness level in the machine.
According to the research, the Clean dry air supplies the air curtain and clear-out system. As soon as the flow of clear air gets transfer in the FOUP door, this will automatically prevent the moisture from going inside the machine. There is approximately 0% RH found in the initial pre-purged FOUP. However, the ratio of RH in the mini-environment can be seen by 43%. Therefore, if the door of FOUP is remains opened, it may hold the moisture quickly. Moreover, the CDA is ultra-essential in order to reduce the relative humidity. And this can be possible with the massive diffuser panel purge processes. In order to save the FOUP from moisture, the CDA rate of panel-purge equipment must be kept around 250 L/min, and the air curtain flow rate must be about 150 L/min.
Some benefits of using the 300mm FOUP Wafer Load Port
- It provides complete compatibility for all the SEMI standard FOUPs.
- ROHS Compliant, SEMI Complaint, & CE certification ensure high-level performance.
- There is no door & plate alignment required with the 300mm FOUP.
- It also comes up with bearings & lubrication-free screws.
- Robust characteristics of 300mm FOUP include programmable lights, buttons, AMHS options, RFID, Barcode, OCR scanning, and Class 1 cleanliness.
Are you looking for a wafer-handling Robot? Then you must discover the Kensington Labs are known for having skillful engineers who acquire top-level experience in robot repairing. The main focus of Kensington is to offer the most innovative, outstanding and reliable, wafer handling robots, ADOs, end-effectors, as well as aligners to the customers at reasonable prices. The wafer handling Kensington Robot provided by the company will surely amaze you. This is one of the trustworthy platforms where you can connect without any hesitation.
