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What you all need to know about the 300mm FOUP Load Port Wafer Handling Robot?

Wafer Handling Robots

· Wafer Handling
broken image

With being the technology leader in the wafer handling automation products exhibits their 300mm wafer handling robot. The Kensington Laboratories' ADO proves the volume manufacturing at specific 300mm FOUP production fabs, which is supported by the worldwide service and support network.

What does all robot installation take?
  • Automation
  • Abrupt set-up without the help of the experts
  • The robotic interchangeability
  • The production scalability
What does built-in sensor works?
  • It measures the position of the wafer, detects and calculates it.
  • It also improvises the system accuracy.
What does a shaped LED beam offer in this?
  • Integrated end effector sensor
  • LED for reliability and safety

The wafer mapping identifies the stacked wafer cassette errors, and the cross slotted wafer cassette errors. Its wafer position helps in elevation and edge detection. Its shaped beam permits the measurements vs. the presence/absence detection. It measures both x and z wafer positions.

The actuator deployment has a controlled force for secure gripping wafers. The fail safe closed-loop design has a grip over the wafer in both the power and vacuum loss. The true edge grip has minimal contact with the wafer edge and virtually eradicates the backside contamination from the robot gripper.

It features:

  • Interoperability: It is fully compatible with the SEMI standard FOUPs.
  • Cleanliness: It presents better than Class 1 particle performance when integrated into Class 100 or a better environment.
  • Trustworthiness: The robust design, which is combined with the precision assembly, acquires superior dependability, and lifetime performance.
  • Zero Preventative performance: The superior precision design needs no lubrication or re-alignment periodically.
  • Repeatability: The industry-leading design makes use of the DSP controlled electro-mechanical/pneumatic closed-loop servos for precise, repeatable motion.
  • Wafer Mapping: The high performant break the beam wafer mapping option permits the rapid, accurate wafer detection.
  • Fab customization: The configurable features involve the programmable lights, buttons, carrier ID, and AMHS options.

Let us talk about the key features that 300mm FOUP offers:

  • Carrier ID R/W at the dock and undock
  • Twist and Pull FOUP door attach
  • FEOL and BEOL lockout pins
  • Twist and Pull center lock FOUP clamp
  • Servo control/force feedback motion technology
  • FOUP placement sensors
  • Finger safe motion control safety circuit
  • Configurable status lights
  • Flash firmware uploadable
  • Integrated self-test diagnostics
  • Programmable AMHS drop off states

The gushing manufacturing process, while checking the cleanliness and environmental control, is considered as the wafer handling equipment. It has mounted from the semiconductor devices manufacturing, and that is also within the semiconductor wafer front end industry.

Kensington Laboratories suffice the clients' significant requirements and perform its best to bestow the comprehensive and best scope of the items from ADOs, end-effectors, and wafer handling robots at a very affordable rate.

Moreover, Kensington robot stage repair units are crafted to reduce downtime and improve productivity at a certain level. It can be further rapidly and easily installed on-site by the customers without any help of the particular tool or testing.